Integrated Circuits Silicon Wafer Made by Copper Process (8 Inch)

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Package Dimensions: 8.66 x 8.5 x 2.09 inches; 4.66 ounces
Date First Available: April 26, 2024
Manufacturer: Esthepro
ASIN: B0D2QPT7BT

Wafer Pattern May Vary from the Product Images. Great to be used as gift, display object, exhibition, educating demonstration, testing, decoration or your collection
Beautiful microchip pattern structure made by the advanced copper technology
90~130nm minimum microchip feature Copper Characterization with TEOS or Black Diamond Low-k ILD on the single crystal silicon wafer
The original value of un-polished wafer is above $500
No guarantee for research and other applications

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